Finetech Electronic 294 FPL-J

A BGA micro soldering system of the series "Fineplacer 294 FPL-J" from the Berlin manufacturer Finetech Electronic GmbH & Co. KG.

The soldering unit consists of a soldering head module with a nitrogen bottle including fittings and various hoses. It is complemented, among other things, by a Leica stereo microscope for fine positioning of components with Leica Wild M3Z optics, a Watec swivel video system for soldering process monitoring and inspection with a Panasonic control screen and a PCB holder equipped with a full-surface underwater.

Finally, the custom-built work table offers various control and monitoring devices adapted to the soldering process with a CD-ROM computer unit including a monitor. Documentation and operating instructions are available, as well as soldering heads and pipettes.

Fineplacer 294 FPL-J is a specific model of a high-precision die bonder machine manufactured by Finetech. Die bonders are used in the semiconductor and microelectronics industry to attach tiny electronic components (such as integrated circuits or semiconductor chips) to substrates or printed circuit boards (PCBs) with extreme precision. This process is essential for the assembly of semiconductor devices and microelectronic packages.

Here are some key features and capabilities of the Fineplacer 294 FPL-J:

1. High Precision: The Fineplacer 294 FPL-J is designed for high-precision die bonding, with accuracy in the micrometre range, ensuring that electronic components are placed accurately on the substrate.
2. Flexible Bonding Options: It offers flexibility in terms of the types of bonds it can create, including epoxy, eutectic, and flip-chip bonds, to accommodate various assembly requirements.
3. Multi-Component Bonding: The machine can handle the bonding of multiple components on a single substrate, making it suitable for complex assemblies.
4. Substrate Heating and Temperature Control: Some models may include temperature control features to ensure proper bonding, especially for eutectic bonding.
5. User-Friendly Software: It often includes user-friendly software for easy programming and setup.
6. Inline Inspection: The machine may have inline inspection systems to ensure bond quality and consistency.
7. Versatile Bonding Techniques: It supports various bonding techniques, including thermocompression bonding and ultrasonic bonding.
8. Vacuum Handling: A vacuum handling system is typically used to securely pick and place components during the bonding process.

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