2014 Viscom S3088 SPI

Based on the nameplate you provided and the technical data for the S3088 SPI (Solder Paste Inspection) variant, here are the key specifications for your machine:

PCs replaced in 2024 to new ones

Core Inspection Capabilities

The S3088 SPI is a specialized high-performance system designed to detect printing defects immediately after the stencil printer.

• Inspection Scope: Analyzes solder paste deposits for volume, height, form, area, displacement (X/Y offset), and smearing.
• Component Compatibility: Capable of inspecting demanding assemblies with CSPs, micro BGAs, and pad sizes down to 01005.
• 3D Technology: Uses a fringe projection process for precise 3D height and volume measurement.
• Inspection Speed: Up to 80 cm²/s (depending on resolution settings).

Technical Specifications (from your Nameplate & Records)

FeatureDetailsTypeS3088 SPI (Serial No. 102688)Year of Manufacture09/2014ResolutionUp to 15 µm/pixel (lateral)Z-ResolutionTypically 0.1 µm or 0.5 µm for height measurementMax PCB Size$508\text{ mm} \times 508\text{ mm}$ (standard)Positioning UnitSynchronous linear motors for high-speed accuracyPower Consumption1.2 kW (at 230/400V)Weight700 kg

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