2018 Samco FlexLiner II

Manufacturer:  Samco

Model: FlexLiner II 

Year of Manufacture: 2018

Type of Machine : UCP plasma machine

The samco-ucp FlexLiner II is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages. This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head. Dimensions: 1,520 mm (W) x 1,410 mm (D) x 2,130 mm (H)

Key Features and Benefits

• Single substrate production equipment for various types and dimensions of substrates and magazines up to 300 mm x 300 mm
• Gentle handling with minimal movement of substrates and magazines
• Touchscreen GUI for user-friendly, intuitive operation
• Multiple sensor controls for highly reliable operation
• High throughput due to simultaneous (un)loading and plasma processing
• Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal

Applications

• Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
• Surface treatment for improvement of gluing, bonding or encapsulation
• Mainly surface activation and removal of oxides or organic residues
• Optimum plasma processing for a variety of materials in semiconductor technology

Find more here - https://www.ucymachines.com/

Contact us at - sales@ucymachines.com